Bubble Interaction and Heat Transfer Characteristics of Microchannel Flow Boiling With Single and Multiple Cavities
Akash Priy, Israr Ahmad, Mohd. Kaleem Khan, Manabendra Pathak
Abstract
Abstract Flow boiling in microchannels can effectively address the challenges of high power density heat dissipation in electronic devices. However, the intricate bubble dynamics during the two-phase flow in microchannel necessitates understanding the characteristics of complex bubble hydrodynamics. In this study, we perform 2D numerical simulations of flow boiling using the Cahn-Hilliard phase-field method for a 200-µm width microchannel with single and multiple cavities in COMSOL Multiphysics (V5.3). The numerical model successfully captures bubble dynamics, encompassing vapor embryo generation, bubble growth, departure, coalescence, sliding, and stable vapor plug formation. The heat transfer mechanism inside the microchannel is dominated by bubble nucleation and thin-film evaporation. Elevated wall superheats in a single nucleation cavity, and increased mass flux facilitates higher bubble departure frequency and heat transfer performance. Temporal pressure fluctuations are observed inside microchannels in multiple cavities due to bubble coalescence, departure, and subsequent nucleation. Increasing the nucleating cavities from 2 to 5 within the microchannel while maintaining consistent cavity spacing of 100 µm has resulted in nearly 32% enhancement in heat transfer performance. This study offers valuable findings that can help improve the thermal management of electronic devices.