Study on subsurface microcrack damage depth of diamond wire as-sawn sapphire crystal wafers
Zhenfeng Zhu, Yufei Gao, Xing-Chun Zhang
Topics & Concepts
Materials scienceSapphireDiamondAbrasiveWaferBrittlenessComposite materialCrystal (programming language)Diamond toolOpticsDiamond turningOptoelectronicsLaserComputer sciencePhysicsProgramming languageAdvanced Surface Polishing TechniquesDiamond and Carbon-based Materials ResearchTunneling and Rock Mechanics