Analysis of stress in sputter-deposited films using a kinetic model for Cu, Ni, Co, Cr, Mo, W
Tong Su, Zhaoxia Rao, Sarah Berman, Diederik Depla, Eric Chason
Topics & Concepts
Kinetic energySputteringMaterials scienceStress (linguistics)CurvatureWaferDeposition (geology)Particle (ecology)Thin filmMetallurgyNanotechnologyMathematicsPhysicsGeometryOceanographyLinguisticsSedimentGeologyBiologyPaleontologyPhilosophyQuantum mechanicsMetal and Thin Film MechanicsCopper Interconnects and ReliabilityHigh-Temperature Coating Behaviors