Litcius/Paper detail

Anodic Electrodeposition of Chitosan–AgNP Composites Using In Situ Coordination with Copper Ions

D. S. Kharitonov, Aliaksandr A. Kasach, Agnieszka Gibała, Małgorzata Zimowska, И. И. Курило, Angelika Wrzesińska, Lilianna Szyk‐Warszyńska, Piotr Warszyński

2021Materials15 citationsDOIOpen Access PDF

Abstract

Chitosan is an attractive material for biomedical applications. A novel approach for the anodic electrodeposition of chitosan–AgNP composites using in situ coordination with copper ions is proposed in this work. The surface and cross-section morphology of the obtained coating with varying concentrations of AgNPs were evaluated by SEM, and surface functional groups were analyzed with FT-IR spectroscopy. The mechanism of the formation of the coating based on the chelation of Cu(II) ions with chitosan was discussed. The antibacterial activity of the coatings towards Staphylococcus epidermidis ATCC 35984/RP62A bacteria was analyzed using the live–dead approach. The presented results indicate that the obtained chitosan–AgNP-based films possess some limited anti-biofilm-forming properties and exhibit moderate antibacterial efficiency at high AgNP loads.

Topics & Concepts

ChitosanMaterials scienceCopperChelationCoatingChemical engineeringIonAntibacterial activitySurface modificationAnodeBiofilmComposite materialNuclear chemistryMetallurgyElectrodeChemistryBacteriaOrganic chemistryBiologyPhysical chemistryGeneticsEngineeringConducting polymers and applicationsNanocomposite Films for Food PackagingPolymer Surface Interaction Studies
Anodic Electrodeposition of Chitosan–AgNP Composites Using In Situ Coordination with Copper Ions | Litcius