Research on fatigue of TSV-Cu under thermal and vibration coupled load based on numerical analysis
Zhengwei Fan, Yao Liu, Xun Chen, Yu Jiang, Shufeng Zhang, Yashun Wang
Topics & Concepts
Reliability (semiconductor)Service lifeVibrationThrough-silicon viaStructural engineeringEngineeringReliability engineeringMechanical engineeringMaterials scienceAutomotive engineeringPower (physics)Electrical engineeringWaferPhysicsQuantum mechanics3D IC and TSV technologiesElectronic Packaging and Soldering TechnologiesAdditive Manufacturing and 3D Printing Technologies