Dual-layer cylindrical array of pin–fin microchannels with heat dissipation capacity up to 1200 W/cm2
Ci Ao, Bo Xu, Zhenqian Chen
Topics & Concepts
Materials scienceFinDissipationDual layerDual (grammatical number)Thermal management of electronic devices and systemsMechanicsLayer (electronics)ThermodynamicsPhysicsComposite materialMechanical engineeringLiteratureEngineeringArtHeat Transfer and OptimizationHeat Transfer and Boiling StudiesSilicon Carbide Semiconductor Technologies