Effect of deposition temperature on mechanical properties of nanotwinned Cu fabricated by rotary electroplating
Hsiang-Yuan Cheng, Dinh-Phuc Tran, K. N. Tu, Chih Chen
Topics & Concepts
ElectroplatingMaterials scienceElectrolyteUltimate tensile strengthMicrostructureAnodeMetallurgyCopperCurrent densityGrain sizeComposite materialCathodeElectrodeChemistryLayer (electronics)Physical chemistryPhysicsQuantum mechanicsMicrostructure and mechanical propertiesAluminum Alloys Composites PropertiesElectrodeposition and Electroless Coatings