Litcius/Paper detail

Structure and properties of low-Ag SAC solders for electronic packaging

Xiao Lu, Liang Zhang, Xi Wang, Mulan Li

2022Journal of Materials Science Materials in Electronics26 citationsDOI

Topics & Concepts

Materials scienceMicrostructureWettingReliability (semiconductor)CreepMetallurgySolderingDopingCorrosionComposite materialOptoelectronicsPower (physics)Quantum mechanicsPhysicsElectronic Packaging and Soldering Technologies3D IC and TSV technologiesAluminum Alloys Composites Properties
Structure and properties of low-Ag SAC solders for electronic packaging | Litcius