Densification behavior, mechanical and electrical properties of in-situ TiB2p/Cu composite powder via vacuum hot pressing
Hao Shi, Fei Cao, Haidong Zhang, Tongle Wang, Huaibao Gao, Binbin Wen, Juntao Zou, Yihui Jiang, Shuhua Liang
Topics & Concepts
Materials scienceComposite numberIn situSinteringUltimate tensile strengthComposite materialRelative densityHot pressingElectrical resistivity and conductivityPressingMeteorologyElectrical engineeringPhysicsEngineeringAluminum Alloys Composites PropertiesAdvanced materials and compositesAdvanced ceramic materials synthesis