Signal Integrity Design and Analysis of Universal Chiplet Interconnect Express (UCIe) Channel in Silicon Interposer for Advanced Package
Taein Shin, Keunwoo Kim, Hyunwook Park, Boogyo Sim, Seongguk Kim, Jihun Kim, Seonguk Choi, Joonsang Park, Jinwook Song, Jaehyup Kim, Joung Won Park, Daehyun Kang, Joungho Kim
Abstract
In this paper, we design and analyze the Universal Chiplet Interconnect Express (UCIe) channel considering signal integrity (SI) in silicon interposer for advanced package. In a chiplet system, various chips from other vendors are integrated into one package using common UCIe channels. Silicon interposer is a promising advanced package that can achieve high bandwidth with high channel density. First of all, we investigate the possible interconnect dimensions considering a rout-ability in UCIe specification. Then, we propose transmission line-based interconnect structures with different signal/ground patterns for 2- and 3-layer routing in 32 Gbps operation. Since the advanced package has an unterminated system, the voltage transfer function is used as the SI specification of interconnect in a frequency domain. Also, bump arrays are included at Tx and Rx side in a full channel eye-diagram simulation. We verified the crosstalk in an interconnect is the main bottleneck for channel design, and the bump causes loss by adding a capacitance than the crosstalk effect. The grounded coplanar waveguide (GCPW) based interconnect can be the promising solution with a minimum 2 metal layers for signals in a silicon interposer.