High Frequency Characteristics of Glass Interposer
Masaya Tanaka, Satoru Kuramochi, Takahiro Tai, Yoichiro Sato, Nobutaka Kidera
Abstract
As electronic product becomes smaller and lighter with an increasing number of functions. The demand for high density and high integration becomes stronger. The major engineering requirements for 5G and beyond are low loss, precision manufacturing and low cost. Because of the shortwave length, extreme attenuation and low-cost requirements, the holy grail in the industry is ultra-miniaturized mm-wave structures. To achieve high-speed 5G communication standards, miniaturization and short signal pathways are required. This can only be achieved by designing and demonstrating advanced through quartz via (TQV) substrates and multi-layer RDL's. To demonstrate the performance of quartz glass as a substrate material, we will build interposers with fine pitch TQV with metallization coupled with double sided routing distribution layers utilizing low loss dielectric polymer layers. This paper will model high frequency characteristics for 2.5D high speed applications. We will also demonstrate quartz glass is the ideal candidate for the emerging mm-wave antenna technologies for 5G and beyond.