Pull-off dynamics of mushroom-shaped adhesive structures
Ruozhang Li, Dongwu Li, Jun Sun, Xiaolong Zhang, Wenming Zhang, Wenming Zhang
Topics & Concepts
ScalingMaterials scienceAdhesiveMechanicsViscoelasticityComposite materialFracture mechanicsPhysicsGeometryMathematicsLayer (electronics)Adhesion, Friction, and Surface InteractionsForce Microscopy Techniques and ApplicationsMechanical stress and fatigue analysis