Plasma Cleaning Technology: Mechanisms, Influencing Factors, and Applications
Jianan Sun, Yang Yu, Jianming Tang, Yan Zeng, Jiaxuan Chen
Abstract
Plasma cleaning technology has emerged as a revolutionary approach in surface treatment, offering a non-contact, non-destructive, and environmentally friendly alternative to traditional cleaning methods. This paper provides a comprehensive review of the mechanisms, influencing factors and applications of plasma cleaning technologies. The characteristics of plasma cleaning technologies with different excitation methods, such as direct current discharge, low-frequency discharge, radio frequency discharge, and microwave plasma cleaning, are analyzed. The key factors that affect the cleaning effectiveness, such as the type of working gas, pressure, discharge power, cleaning duration and working distance, have been summarized. The applications of plasma cleaning are explored extensively, highlighting its significance in the maintenance of optical components, semiconductor industry, surface treatment of metals and metal oxides, and conservation of cultural heritage. Finally, the paper discusses the current challenges faced by plasma cleaning technology and offers perspectives on future trends.