Effects of GNSs addition on the electromigration of Sn58Bi and Cu-core Sn58Bi joint
Peng Liu, Weiqi Guo, Ping Wu
Topics & Concepts
SolderingElectromigrationGNSS applicationsMicrostructureCore (optical fiber)IntermetallicMaterials scienceJoint (building)Computer scienceMetallurgyComposite materialStructural engineeringTelecommunicationsEngineeringGlobal Positioning SystemAlloyElectronic Packaging and Soldering Technologies3D IC and TSV technologiesIntermetallics and Advanced Alloy Properties