Thermal management in TSV based 3D IC Integration: A survey
Venkata Kiran Sanipini, Banothu Rakesh, Aruna Jyothi Chamanthula, N. Santoshi, A. Arunkumar Gudivada, Asisa Kumar Panigrahy
Topics & Concepts
Three-dimensional integrated circuitStackingThrough-silicon viaIntegrated circuitMaterials scienceThermalThermal management of electronic devices and systemsCMOSVertical integrationSiliconElectronic engineeringOptoelectronicsEngineeringMechanical engineeringNuclear magnetic resonanceLawMeteorologyPhysicsPolitical science3D IC and TSV technologiesAdditive Manufacturing and 3D Printing TechnologiesElectronic Packaging and Soldering Technologies