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Mechanical properties and thermal stability of reactively sputtered multi-principal-metal Hf-Ta-Ti-V-Zr nitrides

A. Kirnbauer, A. Kretschmer, Christian Koller, Tomasz Wójcik, V. Paneta, Marcus Hans, Jochen M. Schneider, P. Polcik, P.H. Mayrhofer

2020Surface and Coatings Technology106 citationsDOIOpen Access PDF

Abstract

Crystalline (Hf,Ta,Ti,V,Zr)N nitride thin films, with a high-entropy metal-sublattice, were synthesized at 440 °C by reactive magnetron sputtering using an equimolar Hf-Ta-Ti-V-Zr-compound target. The coatings are single-phase fcc structured mono-nitrides for N2/(Ar + N2) flow-rate-ratios (fN2) between 30 and 45%. For higher fN2 a small fraction of a second phase (next to the fcc matrix) can be detected by X-ray diffraction (XRD) and selected area electron diffraction (SAED). All coatings studied (prepared with fN2 between 30 and 60%) show similar chemical compositions and hardness (H) values between 30.0 and 34.0 GPa with indentation moduli of ~460 GPa. Atom probe tomography (APT) indicates a homogenous distribution of all elements within our fcc-(Hf,Ta,Ti,V,Zr)N even after vacuum-annealing at 1300 °C. While H decreased from 32.5 to 28.1 GPa by this annealing treatment, the coating is still single-phase fcc structured with a defect density (expressed by XRD and SAED features, transmission electron microscopy contrast, and grain sizes) comparable to the as-deposited state. Only after vacuum-annealing at 1500 °C, XRD and APT reveal the formation of hexagonal structured (Ta,V)2N. The onset of nitrogen-loss – detected by thermogravimetric analysis – is ~1350 °C. Based on our results we can conclude that the sluggish diffusion within our fcc-(Hf,Ta,Ti,V,Zr)N warrants the single-phase fcc structure up to 1300 °C, although ab initio based calculations would suggest the lower-entropy products [fcc-(Hf,Zr)N, fcc-(Ta,V)N, and fcc-TiN] and [fcc-(Hf,Zr)N and fcc-(Ta,Ti,V)N] to be energetically more stable up to 1302 K.

Topics & Concepts

Materials scienceAnalytical Chemistry (journal)Selected area diffractionAnnealing (glass)NitrideThermal stabilitySputter depositionX-ray photoelectron spectroscopyNanoindentationCrystallographySputteringTransmission electron microscopyMetallurgyThin filmComposite materialNanotechnologyChemical engineeringChemistryEngineeringLayer (electronics)ChromatographyMetal and Thin Film MechanicsAdvanced Materials Characterization TechniquesDiamond and Carbon-based Materials Research