Viscoelastic model to capture residual stresses in heat cured dissimilar adhesive bonded joints
Akshat Agha, Fadi Abu-Farha
Topics & Concepts
Materials scienceAdhesiveComposite materialViscoelasticityCuring (chemistry)EpoxyDifferential scanning calorimetryAdhesive bondingResidual stressEpoxy adhesiveFinite element methodJoint (building)Lap jointStructural engineeringLayer (electronics)ThermodynamicsPhysicsEngineeringEpoxy Resin Curing ProcessesMechanical Behavior of CompositesInjection Molding Process and Properties