Litcius/Paper detail

Fingerprint of the inverse Rashba-Edelstein effect at heavy-metal/Cu interfaces

Rui Yu, B. F. Miao, Qi Liu, Kang He, Weishan Xue, Liang Sun, Mingzhong Wu, Yizheng Wu, Zhe Yuan, Haifeng Ding

2020Physical review. B./Physical review. B27 citationsDOI

Abstract

We report the direct observation of the fingerprint of the inverse Rashba-Edelstein effect (IREE) via investigations of the spin-to-charge conversion in Ta(Pt)/Cu and Cu/Ta(Pt) as a function of the heavy-metal thickness. The converted charge voltages have opposite signs for samples with reversed stacking orders in the ultrathin regime and have the same sign at higher thickness. The effect is demonstrated with two independent experimental approaches and supported by first-principles calculations. Our observations unambiguously demonstrate the existence of the IREE at heavy-metal/Cu interfaces and provide a framework for manipulating the spin-charge conversion via interface engineering.

Topics & Concepts

StackingInverseMaterials scienceMetalSpin (aerodynamics)Charge (physics)Fingerprint (computing)Condensed matter physicsSign (mathematics)PhysicsNuclear magnetic resonanceQuantum mechanicsComputer scienceThermodynamicsComputer securityGeometryMathematical analysisMetallurgyMathematicsQuantum and electron transport phenomenaMagnetic properties of thin filmsSurface and Thin Film Phenomena