Comparative study of reactive diluents with different molecular structures on the curing properties of epoxy adhesives and the interface bonding properties with mortar
Qiang Yuan, Zan Wang, Hao Yao, Ju Huang, Shenghao Zuo, Hai Huang
Topics & Concepts
AdhesiveEpoxyDiluentMaterials scienceCuring (chemistry)Ultimate tensile strengthDiglycidyl etherComposite materialBond strengthChemistryOrganic chemistryBisphenol ALayer (electronics)Corrosion Behavior and InhibitionConcrete and Cement Materials ResearchPolymer composites and self-healing