Silicon Dielectric Diplexer Module for 600-GHz-Band Frequency-Division Multiplexing Wireless Communication
Norihiko Shibata, Yuta Uemura, Yuma Kawamoto, Li Yi, Masayuki Fujita, Tadao Nagatsuma
Abstract
We developed a silicon (Si) dielectric diplexer module for 600-GHz-band frequency-division multiplexing wireless communication. This diplexer was developed based on Si dielectric waveguide technology, which provides low-loss transmission characteristics compared with the conventional metallic terahertz-transmission platform, such as metallic hollow waveguides. It includes straight waveguides based on an effective medium composed of Si and air, and a coupler comprising of two adjacent unclad Si waveguides. Furthermore, for the communication system integration, we developed a practical and low-insertion loss module with WR1.5 metallic hollow waveguide input–output interfaces and modularized the diplexer. We performed transmission measurement experiments with the fabricated diplexer module and achieved 3-dB bandwidths of 101 and 37 GHz, and crosstalk of <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><tex-math notation="LaTeX">$-$</tex-math></inline-formula> 34 dB at 680 GHz and <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><tex-math notation="LaTeX">$-$</tex-math></inline-formula> 41 dB at 618 GHz in the cross and bar directions, respectively. Finally, we performed a two-channel wireless communication experiment using the developed diplexer module in the 600-GHz band. We achieved error-free communication at 10 and 6 Gbit/s on the cross and bar channels, respectively. In addition, we achieved a data rate of up to 12.5 Gbit/s at the forward error correction limits for both channels.