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Case-embedded cooling for high heat flux microwave multi-chip array

Yunqian Song, Rong Fu, Chuan Chen, Qidong Wang, Meiying Su, Fengze Hou, Xiaobin Zhang, Jun Li, Liqiang Cao

2022Applied Thermal Engineering28 citationsDOI

Topics & Concepts

High heatChipMaterials scienceMicrowaveHeat fluxNuclear engineeringFlux (metallurgy)Thermal management of electronic devices and systemsWater coolingMechanical engineeringEngineeringHeat transferElectrical engineeringThermodynamicsComposite materialMetallurgyTelecommunicationsPhysicsHeat Transfer and OptimizationHeat Transfer and Boiling StudiesPhotonic and Optical Devices
Case-embedded cooling for high heat flux microwave multi-chip array | Litcius