Damage-free dry transfer method using stress engineering for high-performance flexible two- and three-dimensional electronics
Yoonsoo Shin, S.‐K. Hong, Yong Chan Hur, Chanhyuk Lim, Kyungsik Do, Ji Hoon Kim, Dae‐Hyeong Kim, Sangkyu Lee
Topics & Concepts
Transfer printingMaterials scienceElectronicsStretchable electronicsFlexible electronicsNanotechnologyFabricationThin filmBilayerComposite materialElectrical engineeringMembraneGeneticsMedicinePathologyEngineeringAlternative medicineBiologyAdvanced Sensor and Energy Harvesting MaterialsNanomaterials and Printing TechnologiesAdvanced Materials and Mechanics