Research on Bi contents addition into Sn–Cu-based lead-free solder alloy

Hai Huang, Bin Chen, Xiaowu Hu, Xiongxin Jiang, Qinglin Li, Yinhui Che, Shuai Zu, Dingjun Liu

2022Journal of Materials Science Materials in Electronics17 citationsDOI

Topics & Concepts

Materials scienceAlloyMicrostructureScanning electron microscopeCorrosionMetallurgyDifferential scanning calorimetryDielectric spectroscopyIndentation hardnessSolderingUltimate tensile strengthVickers hardness testComposite materialElectrochemistryElectrodePhysicsPhysical chemistryThermodynamicsChemistryElectronic Packaging and Soldering TechnologiesIntermetallics and Advanced Alloy Properties3D IC and TSV technologies