Realizing high-strength diffusion bonding of copper at ultra-low temperatures via single point diamond turning and spark plasma sintering
Wendi Li, Yuxin Liang, Yang Bai, Tiesong Lin, Bangsheng Li, Zhiqiang Fu, Jicai Feng
Topics & Concepts
Spark plasma sinteringMaterials scienceCopperDiamondDiffusion bondingSurface roughnessDiamond turningNanoscopic scaleSinteringDiffusionMetallurgyPlasmaDiamond toolComposite materialNanotechnologyThermodynamicsQuantum mechanicsPhysicsAluminum Alloys Composites PropertiesAdvanced materials and compositesMetal and Thin Film Mechanics