Litcius/Paper detail

Interfacial strength and microstructure of AlN/Cu joints produced by a novel brazing method facilitated by porous copper layer and Ag foil

Yilian Huang, Renli Fu, Xudong Chen, Bo Cheng, Simeon Agathopoulos

2021Journal of Materials Science Materials in Electronics13 citationsDOI

Topics & Concepts

Materials scienceBrazingMicrostructureFOIL methodCeramicComposite materialLayer (electronics)Shear strength (soil)Substrate (aquarium)Eutectic systemCopperMetallurgyAlloySoil waterEnvironmental scienceGeologySoil scienceOceanographyAdvanced ceramic materials synthesisAluminum Alloys Composites PropertiesSilicon Carbide Semiconductor Technologies
Interfacial strength and microstructure of AlN/Cu joints produced by a novel brazing method facilitated by porous copper layer and Ag foil | Litcius