An Automated Electro-Thermal-Mechanical Co-Simulation Methodology Based on PSpice-MATLAB-COMSOL for SiC Power Module Design
Yayong Yang, Yuxin Ge, Zhiqiang Wang, Yong Kang
Abstract
The design of power module requires an accurate multi-physical fields simulation methodology to simulate the electro-thermal stress accurately. The paper proposed an automated multi-physical fields modeling and co-simulation methodology based on intelligent software interfaces for SiC power module design. Firstly, the multi-physical fields coupling mechanism and basic co-simulation principle of the proposed methodology are described. Then, the co-simulation software interface and indirect coupling strategy are designed for this methodology, which can reflect the evolution of various physical fields from initial condition to steady state through continuous transient simulation. Finally, the proposed co-simulation methodology is verified by direct steady-state thermal simulation of a SiC MOSFET power module. The simulation results from the steady-state thermal simulation demonstrate the feasibility and accuracy of the proposed simulation methodology.