Litcius/Paper detail

Analysis on ground surface in ultrasonic face grinding of silicon carbide (SiC) ceramic with minor vibration amplitude

Chenwei Dai, Zhen Yin, Ping Wang, Qing Miao, Jiajia Chen

2021Ceramics International73 citationsDOI

Topics & Concepts

Materials scienceGrindingSurface roughnessCeramicUltrasonic sensorVibrationAmplitudeMachiningComposite materialSurface finishSilicon carbideBrittlenessUltrasonic machiningAcousticsMetallurgyOpticsPhysicsAdvanced Surface Polishing TechniquesAdvanced machining processes and optimizationAdvanced Machining and Optimization Techniques