Molecular dynamics simulations of tensile response for FeNiCrCoCu high-entropy alloy with voids
Tinghong Gao, Han Song, Bei Wang, Yue Gao, Yutao Liu, Quan Xie, Qian Chen, Qingquan Xiao, Yongchao Liang
Topics & Concepts
Void (composites)Materials scienceUltimate tensile strengthComposite materialAlloyStrain rateDislocationMolecular dynamicsChemistryComputational chemistryHigh Entropy Alloys StudiesHigh-Temperature Coating BehaviorsAdvanced materials and composites