Litcius/Paper detail

Jet Impingement Heat Sinks With Application Toward Power Electronics Cooling: A Review

Corey Klinkhamer, K. Lakshmi Varaha Iyer, Majed Etemadi, Ram Balachandar, Ron M. Barron

2023IEEE Transactions on Components Packaging and Manufacturing Technology26 citationsDOI

Abstract

As electrified vehicles grow in popularity, there is an increasing demand to improve the cost, reliability, power density, and efficiency of onboard power electronics. Conventional cooling techniques are reaching their cooling limitations, which calls for the need to improve thermal management solutions. Novel solutions must meet current cooling targets while remaining cost effective, efficient, and compact. Impinging jet technology has proven to be a promising solution that provides localized cooling and is simple to implement in an automotive cooling application. In this article, jet impingement and its application toward cooling power electronics are comprehensively reviewed. Key flow and heat transfer features of jet impingement, heat sink optimization, enhancement techniques, and limitations are addressed in this review to provide a clear depiction of the state-of-the-art.

Topics & Concepts

Heat sinkElectronicsElectronics coolingComputer coolingActive coolingPower electronicsMechanical engineeringHeat transferJet (fluid)Reliability (semiconductor)Passive coolingWater coolingComputer scienceAutomotive industryAutomotive engineeringMaterials scienceThermal management of electronic devices and systemsPower (physics)Aerospace engineeringElectrical engineeringEngineeringMechanicsPhysicsQuantum mechanicsVoltageHeat Transfer MechanismsHeat Transfer and OptimizationFluid Dynamics and Turbulent Flows