Joint‐Inspired Liquid and Thermal Conductive Interface for Designing Thermal Interface Materials with High Solid Filling yet Excellent Thixotropy (Adv. Funct. Mater. 14/2023)
Zilong Xie, Zhengli Dou, Die Wu, Xiangtong Zeng, Yuan Feng, Yunfei Tian, Qiang Fu, Kai Wu
Abstract
Contact Thermal Resistance In article number 2214071, Kai Wu, Qiang Fu, and co-workers report a joint-inspired interfacial engineering strategy by employing liquid metal to the surface of rigid alumina, which improves material's thermal conductivity and thixotropy. This method will inspire development of high-performance polymer-based thermal interface materials for future advanced electronics.
Topics & Concepts
Materials scienceThixotropyThermal greaseThermal conductivityInterface (matter)Joint (building)ElectronicsElectrical conductorThermalComposite materialPolymerNanotechnologyContact angleElectrical engineeringStructural engineeringEngineeringPhysicsMeteorologySessile drop techniqueAerogels and thermal insulationAdvanced Sensor and Energy Harvesting MaterialsAdvanced Thermoelectric Materials and Devices