Intermetallic size and morphology effects on creep rate of Sn-3Ag-0.5Cu solder
Yilun Xu, Tianhong Gu, Jingwei Xian, Finn Giuliani, T. Ben Britton, C.M. Gourlay, Fionn P.E. Dunne
Topics & Concepts
CreepIntermetallicMaterials scienceMicrostructureAlloyMetallurgyHardening (computing)DislocationStrain rateSolderingComposite materialLayer (electronics)Microstructure and mechanical propertiesAluminum Alloys Composites PropertiesIntermetallics and Advanced Alloy Properties