Thermally stable and soft pressure-sensitive adhesive for foldable electronics
Woosung Jo, Kihoon Jeong, Young‐Sam Park, Jeong Ik Lee, Sung Gap Im, Taek‐Soo Kim
Topics & Concepts
AdhesiveMaterials scienceBrittlenessDynamic mechanical analysisAcrylateComposite materialCopolymerMonomerModulusElectronicsDurabilityShear strength (soil)PolymerLayer (electronics)ChemistryEnvironmental scienceSoil scienceSoil waterPhysical chemistryAdvanced Sensor and Energy Harvesting MaterialsSynthesis and properties of polymersAdhesion, Friction, and Surface Interactions