Extremely rapid grain growth in scallop-type Cu6Sn5 during solid–liquid interdiffusion reactions in micro-bump solder joints
Andriy Gusak, K. N. Tu, Chih Chen
Topics & Concepts
Materials scienceSolderingScallopJoint (building)Grain sizeGrain growthMetallurgyGrain boundaryDiffusionComposite materialChannel (broadcasting)MicrostructureThermodynamicsStructural engineeringBiologyEcologyPhysicsElectrical engineeringEngineeringElectronic Packaging and Soldering Technologies3D IC and TSV technologiesAluminum Alloys Composites Properties