Inversion of surface damage and residual stress in ground silicon wafers by laser surface acoustic wave technology
Zaiwei Liu, Bin Lin, Xiaohu Liang, Anyao Du
Topics & Concepts
Residual stressWaferMaterials scienceInversion (geology)ResidualSurface acoustic waveSurface (topology)LaserAcousticsSiliconSurface waveStress waveOpticsGeologyComposite materialOptoelectronicsComputer scienceSeismologyGeometryPhysicsMathematicsAlgorithmTectonicsAdvanced Surface Polishing TechniquesLaser Material Processing TechniquesIntegrated Circuits and Semiconductor Failure Analysis