Applications of Ni and Ag metallizations at the solder/Cu interfaces in advanced high-power automobile interconnects: An electromigration study
Meng-Chun Chiu, Min‐Yan Tsai, Shan-Bo Wang, Yung‐Sheng Lin, Chien-Lung Liang
Topics & Concepts
ElectromigrationSolderingMaterials scienceMetallurgyPower (physics)CopperEngineering physicsComposite materialEngineeringQuantum mechanicsPhysicsElectronic Packaging and Soldering TechnologiesCopper Interconnects and Reliability3D IC and TSV technologies