Constitutive modelling of annealing behavior in through silicon vias-copper
Yadong Li, Pei Chen, Fei Qin, Tong An, Yanwei Dai, Min Zhang, Yifan Jin
Topics & Concepts
Materials scienceElectron backscatter diffractionAnnealing (glass)NanoindentationMicrostructureComposite materialConstitutive equationThrough-silicon viaElectroplatingCopperMetallurgyFinite element methodSiliconStructural engineeringEngineeringLayer (electronics)3D IC and TSV technologiesAluminum Alloys Composites PropertiesAdvanced Surface Polishing Techniques