A design approach of bonding head guiding platform for die to wafer hybrid bonding application using compliant mechanism

Duc Nam Nguyen, Minh Phung Dang, Saurav Dixit, Thanh-Phong Dao

2022International Journal on Interactive Design and Manufacturing (IJIDeM)20 citationsDOI

Topics & Concepts

ParallelogramDie (integrated circuit)WaferWafer bondingMechanical engineeringMaterials scienceStructural engineeringEngineering drawingEngineeringOptoelectronicsHingePiezoelectric Actuators and Control3D IC and TSV technologiesAdvanced machining processes and optimization