Cu to Cu direct bonding at low temperature with high density defect in electrodeposited Cu
Haneul Han, Chaerin Lee, Youjung Kim, Jinhyun Lee, Rosa Kim, Jongryoul Kim, Bongyoung Yoo
Topics & Concepts
Materials scienceAnnealing (glass)Grain growthCopperStrain (injury)Activation energyGrain sizeMetallurgyCrystallographyChemistryPhysical chemistryMedicineInternal medicineMicrostructure and mechanical propertiesElectronic Packaging and Soldering Technologies3D IC and TSV technologies