Rational utilization of the size and electronic effect of inhibitors enabling high polishing rate with minimum corrosion in copper chemical mechanical polishing
Pengfei Chang, Zisheng Huang, Yulong Chen, Huiqin Ling, Yunwen Wu, Ming Li, Yosi Shacham‐Diamand, Tao Hang
Topics & Concepts
ReaxFFPhysisorptionAdsorptionPolishingCopperCorrosionChemical-mechanical planarizationMolecular dynamicsMaterials scienceChemistryChemical engineeringDensity functional theoryElectrochemistryComputational chemistryMetallurgyPhysical chemistryInteratomic potentialElectrodeEngineeringCorrosion Behavior and InhibitionAdvanced Surface Polishing TechniquesMetal Extraction and Bioleaching