Broadband Metallic Fiber-to-Chip Couplers and a Low-Complexity Integrated Plasmonic Platform
Andreas Messner, Pascal A. Jud, Joel Winiger, Marco Eppenberger, Daniel Chelladurai, Wolfgang Heni, Benedikt Baeuerle, Ueli Koch, Ping Ma, Christian Haffner, Huajun Xu, Delwin L. Elder, Larry R. Dalton, Jasmin Smajić, Juerg Leuthold
Abstract
We present a plasmonic platform featuring efficient, broadband metallic fiber-to-chip couplers that directly interface plasmonic slot waveguides, such as compact and high-speed electro-optic modulators. The metallic gratings exhibit an experimental fiber-to-slot coupling efficiency of -2.7 dB with -1.4 dB in simulations with the same coupling principle. Further, they offer a huge spectral window with a 3 dB passband of 350 nm. The technology relies on a vertically arranged layer stack, metal-insulator-metal waveguides, and fiber-to-slot couplers and is formed in only one lithography step with a minimum feature size of 250 nm. As an application example, we fabricate new modulator devices with an electro-optic organic material in the slot waveguide and reach 50 and 100 Gbit/s data modulation in the O- and C-bands within the same device. The devices' broad spectral bandwidth and their relaxed fabrication may render them suitable for experiments and applications in the scope of sensing, nonlinear optics, or telecommunications.