Effects of annealing temperature and layer thickness on hardening behavior in cross accumulative roll bonded Cu/Fe nanolamellar composite
L.F. Zhang, Rui Gao, Bo Zhao, Meng Sun, Jing Ke, X.P. Wang, Ting Hao, Z.M. Xie, Rui Liu, Q.F. Fang, C.S. Liu
Topics & Concepts
Annealing (glass)Materials scienceInterphaseComposite materialHardening (computing)Accumulative roll bondingComposite numberDislocationLayer (electronics)GeneticsBiologyMicrostructure and mechanical propertiesAluminum Alloys Composites PropertiesAdvanced materials and composites