Thermal layout optimization for 3D stacked multichip modules
Yanning Chen, Dongyan Zhao, Fang Liu, Jie Gao, Hui Zhu
Topics & Concepts
StackingParticle swarm optimizationFinite element methodThermalConvergence (economics)Electronic engineeringThree-dimensional integrated circuitIntegrated circuitEngineeringComputer scienceElectrical engineeringAlgorithmStructural engineeringNuclear magnetic resonancePhysicsEconomicsMeteorologyEconomic growth3D IC and TSV technologiesVLSI and FPGA Design TechniquesElectronic Packaging and Soldering Technologies