Nucleation and growth of low resistivity copper thin films on polyimide substrates by low-temperature atomic layer deposition
Zihong Gao, Chengli Zhang, Junhua Gao, Qiang Wang, Guanglong Xu, Hongtao Cao, Hongliang Zhang, Hongliang Zhang
Topics & Concepts
PolyimideAtomic layer depositionNucleationCopperElectrical resistivity and conductivityAdsorptionMaterials scienceDeposition (geology)Layer (electronics)Thin filmChemical engineeringAnalytical Chemistry (journal)Inorganic chemistryNanotechnologyChemistryMetallurgyPhysical chemistryOrganic chemistrySedimentElectrical engineeringPaleontologyBiologyEngineeringCopper Interconnects and ReliabilitySemiconductor materials and devicesSynthesis and properties of polymers