Effect of horizontal magnetic field on the microstructure and mechanical properties of Ti nanoparticles-reinforced Sn1.0Ag0.5Cu solder: Experimental and first-principles calculations
Chuan-jiang Wu, Liang Zhang, Nan Jiang, Hyoung Seop Kim, Yuhao Chen
Topics & Concepts
MicrostructureMaterials scienceSolderingComposite materialMagnetic fieldField (mathematics)NanoparticleMetallurgyNanotechnologyPhysicsPure mathematicsQuantum mechanicsMathematicsIntermetallics and Advanced Alloy PropertiesAluminum Alloys Composites PropertiesElectronic Packaging and Soldering Technologies