An analytical model to predict the depth of sub-surface damage for grinding of brittle materials
Jingfei Yin, Qian Bai, Saurav Goel, Ping Zhou, Bi Zhang
Topics & Concepts
GrindingMaterials scienceBrittlenessMetastabilityFracture mechanicsWaferFracture (geology)MechanicsDislocationComposite materialNanotechnologyPhysicsQuantum mechanicsAdvanced Surface Polishing TechniquesAdvanced machining processes and optimizationMetal and Thin Film Mechanics