Research on the analytical modeling of critical conditions of serrated Chip formation based on thermal-mechanical coupled material behavior
Bicheng Guo, Feng Jiang, Lan Yan, Ningchang Wang, Hui Huang, Fuzeng Wang, Hong Xie
Topics & Concepts
Materials scienceSofteningConstitutive equationComposite materialSplit-Hopkinson pressure barChip formationSlip (aerodynamics)ThermalChipStrain rateMetallurgyStructural engineeringFinite element methodThermodynamicsElectrical engineeringMachiningPhysicsTool wearEngineeringHigh-Velocity Impact and Material BehaviorAdvanced machining processes and optimizationAdvanced Surface Polishing Techniques