Microstructure evolution and failure mechanism of electromigration in Ag-alloy bonding wire
Chun‐Hao Chen, Pei‐Ing Lee, Tung‐Han Chuang
Topics & Concepts
ElectromigrationElectron backscatter diffractionMicrostructureMaterials scienceAlloyGrain boundaryMicroelectronicsMetallurgyGrain boundary diffusion coefficientCondensed matter physicsComposite materialNanotechnologyPhysicsElectronic Packaging and Soldering TechnologiesCopper Interconnects and ReliabilityElectrodeposition and Electroless Coatings