Kirigami-inspired organic and inorganic film-based flexible thermoelectric devices with built-in heat sink
Chongyang Zeng, Kan Chen, Cevriye Koz, Eleni-Chrysanthi Stefanaki, Eugenio Sebastian Suena Galindez, Han Zhang, Oliver Fenwick, Richard Tuley, Emiliano Bilotti
Abstract
Thermoelectric (TE) devices can convert heat to electricity directly, which offers a unique opportunity to realize waste heat recovery. However, conventional TE devices inevitably use heat sinks, which are bulky, rigid and heavy, limiting practical applications. Herein, we propose a fully integrated film-based TE device with intrinsically built-in fins as heat sink in a hexagonal honeycomb device structure, that simultaneously achieves high TE performance and conformability, as confirmed by experiments and modelling. A flexible Kapton substrate with copper electrodes, integrating either carbon nanotube (CNT) veils or bismuth telluride (Bi2Te3) TE ‘legs’, both of n- and p-type, achieved a remarkable specific power of 185.4 nW K−2 for a Bi2Te3-based device and 53.1 nW K−2 for a CNT-based device, thanks to the heat dissipation effect granted by the built-in fins. Besides, the addition of oriented polymer films interconnects, contracting when above their glass transition temperature, allowed a single substrate two-dimensional (2D) TE device to self-fold into a three-dimensional (3D) hexagonal honeycomb structure, with built-in fins, contactlessly and autonomously. The demonstrated shape-programmed kirigami-inspired scalable TE device paves the way for realising self-powered applications comprising hundreds of TE legs with both inorganic (e.g., Bi2Te3) and organic (e.g. CNT veils) TE materials and integrated heat sinks.