Ge-ion implantation and activation in (100) β-Ga2O3 for ohmic contact improvement using pulsed rapid thermal annealing
Kornelius Tetzner, Andreas Thies, Palvan Seyidov, Ta‐Shun Chou, Jana Rehm, Ina Ostermay, Zbigniew Galazka, Andreas Fiedler, Andreas Popp, Joachim Würfl, Oliver Hilt
Abstract
In this work, we analyze the optimum annealing conditions for the activation of Ge-implanted β-Ga2O3 in order to reach low ohmic contact resistances. The experiments involved the use of a pulsed rapid thermal annealing treatment at temperatures between 900 and 1200 °C in nitrogen atmosphere. Our investigations show remarkable changes in the surface morphology involving increased surface roughness after high-temperature annealing above 1000 °C as well as a significant redistribution of the implanted Ge. Nevertheless, the specific contact resistance is strongly reduced by one order of magnitude after annealing at 1100 °C, reaching a record value of 4.8 × 10−7 Ω cm2 at an implantation activation efficiency of 14.2%. The highest activation efficiency of 19.2% and lowest sheet resistances were reached upon annealing at 1200 °C, which, in turn, showed inferior ohmic contact properties due to a severe increase of the surface roughness. Our results verify the high potential of applying high-temperature annealing processes above 1000 °C after Ge implantation for reaching low ohmic contact resistances to β-Ga2O3.