The impact of Ni and Zn doping on the stability, electrical and thermal conductivity of intermetallic compounds between Sn solder and Cu substrate
Xinyu Wang, Jieshi Chen, Xiao He, Meng Lin, Zhixin Hou, Yu Gun Chun, Hao Lü, Kai Xiong
Topics & Concepts
IntermetallicSolderingMaterials scienceElectrical resistivity and conductivitySubstrate (aquarium)MetallurgyThermal conductivityDopingThermal stabilityCopperComposite materialChemical engineeringOptoelectronicsElectrical engineeringOceanographyGeologyEngineeringAlloyElectronic Packaging and Soldering TechnologiesIntermetallics and Advanced Alloy PropertiesMetallurgical and Alloy Processes